TI900 has a thermal conductivity of 1.8 W/m.k and is designed for applications where the lowest possible thermal impedance is needed. The principle applications of this product are to enhance heat-flow from the device to the heat sink and to provide electrical isolation. TI900 can provide both of these functionalities and offers a great design solution.
 
                 
                 
                 
 
 
 
 Paramètres
        Paramètres
     Livraison rapide
                                    Livraison rapide
                                 Livraison gratuite
                                    Livraison gratuite
                                 Incoterms
                                    Incoterms
                                 Types de paiement
                                    Types de paiement
                                





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