MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

Related Parts

ImageRéférence fabricantDescriptionMéthode de fixationFormeQuantité disponiblePrixAfficher les détails
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MMRuban thermique, adhésif (inclus)Carré, ailettes inclinées90 - Immédiatement$11.01Afficher les détails
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMClip, matériel thermiqueCarré, ailettes inclinées0 - Immédiatement$12.08Afficher les détails
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MMRuban thermique, adhésif (inclus)Carré, ailettes inclinées77 - Immédiatement$9.77Afficher les détails
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MMClip, matériel thermiqueCarrée, ailettes607 - Immédiatement$13.99Afficher les détails
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MMClip, matériel thermiqueCarré, ailettes inclinées935 - Immédiatement$14.57Afficher les détails
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MMClip, matériel thermiqueCarré, ailettes inclinées60 - Immédiatement$14.39Afficher les détails
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MMClip, matériel thermiqueCarré, ailettes inclinées32 - Immédiatement$14.15Afficher les détails
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MMClip, matériel thermiqueCarré, ailettes inclinées100 - Immédiatement$14.26Afficher les détails
HEAT SINK 19MM X 19MM X 9MMATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MMRuban thermique, adhésif (inclus)Carré, ailettes inclinées1372 - Immédiatement$7.42Afficher les détails
PTM Published on: 2011-10-13

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Related Product Highlight

Solutions de fixation de dissipateur thermique Les fixations de dissipateur thermique d'Advanced Thermal Solutions offrent aux ingénieurs de multiples options pour fixer mécaniquement presque n'importe quel dissipateur thermique aux cartes à circuit imprimé.
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.