The challenge and the time-consuming effort of designing with high-speed ADCs is the input network design. This is completely done inside the LTM9001. Additionally, there are several different versions of anti-alias filters available for wide bandwidth or narrow bandwidth applications. Also inside the LTM9001 are the required reference and supply bypass capacitors. These capacitors have a surprising impact on performance if not sized and placed correctly. In traditional lead-frame packages the die sits in the center of the package and bond wires reach to the pins. For higher pin-count packages which tend to be larger, these bond wires can add inductance between the die and the bypass capacitor. If the external capacitor is not placed close enough to the package or there are digital traces running underneath the area, the problem gets worse. Inside the µModule® package, the bond wires are as short as possible and the capacitors are as close as possible. With no external components required, the performance of the ADC is much more immune to layout compromises.