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Therefore, by use of state of the art heat sink and heatsink attachment technology, not only can one improve the device reliability by reducing its temperature, one can also gain significant cost benefits by reducing the PCB assembly time (e.g., vs epoxy or other attachment techniques), provides easy field repair and the ability to salvage the heatsink and its attachment should the board become dysfunctional for other reasons.

PTM Published on: 2011-10-13