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Reflow Conditions for Polymer Capacitors Image of KEMET's Recommended Reflow Conditions Chart

If hand soldering is necessary, a soldering iron should be used to heat the solder pad, applying solder between the pad and the termination until reflow occurs. Once reflow occurs, the iron should be removed immediately. Wiping the edges of a chip and heating the top surface is not recommended.

PTM Published on: 2022-12-20