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Board mounting will thermally stress the devices once more. This final exercising of the components will redefine the distribution once again, resulting in some parts with breakdown voltages that are below the initial screening limit. As the application voltage gets closer to the screening limit, an increase in failure rate may be experienced. However, by following KEMET’s voltage derating guidelines, this risk can be reduced or eliminated all together.
PTM Published on: 2011-10-11
France