



374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | 2,25000 € | 2,25 € |
| 10 | 1,99100 € | 19,91 € |
| 25 | 1,89680 € | 47,42 € |
| 50 | 1,82840 € | 91,42 € |
| 100 | 1,76230 € | 176,23 € |
| 250 | 1,67848 € | 419,62 € |
| 756 | 1,58254 € | 1 196,40 € |
| 1 512 | 1,52518 € | 2 306,07 € |
| 5 292 | 1,42656 € | 7 549,36 € |
| Unit Price without VAT: | 2,25000 € |
|---|---|
| Unit Price with VAT: | 2,70000 € |











