Z-PACK TinMan Connector System

High Density Backplane Connectors

The TE Connectivity AMP Connectors Z-PACK TinMan backplane connector family is a reliable solution for customers searching for a high density, 10+ Gbps performance backplane interconnect system.

The Z-PACK TinMan connector design follows proven industry backplane convention by offering a fully protected right-angle receptacle for use on daughtercards where handling damage can be a concern when mating to a vertical male header. This connector permits field repairability at either the module or single pin levels.

Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high through-put performance levels. Reliability is provided with a dual point of contact mating interface and compliant pin interface to the printed circuit board.

Product Facts

• 10+ Gbps performance
• 100 ohm Impedance for Differential Pair configuration
• 5 pair version offers 26 pairs/10mm [66 differential pairs/inch] fitting within a 25.40 [1.00] card slot pitch
• 4 pair version offers 21 pairs/10mm [53 differential pairs/inch] fitting within a 20.30 [.800] card slot pitch
• 3 pair version offering 16 pairs/10mm [40 differential pairs/inch] fitting within a 16.25 [.625] card slot pitch
• Right angle pin headers (coplanar) in 3 pair, 4 pair, and 5 pair versions
• Reliable, redundant contact design on every signal contact
• Modular system offered in various column versions
• Meets Industry reliability requirements of Bellcore/Telcordia
• Sequencing for ground and signal contacts
• RoHS Compliant

TE Connectivity and TE connectivity (logo) are trademarks.

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