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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
TS991SNL500T4 | |
|---|---|
DigiKey Part Number | 315-TS991SNL500T4-ND |
Manufacturer | |
Manufacturer Product Number | TS991SNL500T4 |
Description | SOLDER PASTE THERMALLY STABLE NC |
Manufacturer Standard Lead Time | 4 Weeks |
Customer Reference | |
Detailed Description | Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) |
Datasheet | Datasheet |
Product Attributes
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Category | Flux Type No-Clean |
Manufacturer Chip Quik Inc. | Mesh Type 4 |
Series | Process Lead Free |
Packaging Bulk | Form Jar, 17.64 oz (500g) |
Part Status Active | Shelf Life 12 Months |
Type Solder Paste | Shelf Life Start Date of Manufacture |
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Base Product Number |
Melting Point 423°F (217°C) |
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In-Stock: 6
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Quantity
All prices are in EUR
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | 92,93000 € | 92,93 € |
| Unit Price without VAT: | 92,93000 € |
|---|---|
| Unit Price with VAT: | 111,51600 € |
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