Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 0.07 oz (2g)
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SMDSWLF.006 2G

DigiKey Part Number
315-SMDSWLF.0062G-ND
Manufacturer
Manufacturer Product Number
SMDSWLF.006 2G
Description
SOLDER WIRE SN96.5/AG3/CU0.5
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 0.07 oz (2g)
Datasheet
 Datasheet
Product Attributes
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Category
Diameter
0.006" (0.15mm)
Manufacturer
Chip Quik Inc.
Melting Point
423 ~ 428°F (217 ~ 220°C)
Packaging
Bulk
Flux Type
No-Clean, Water Soluble
Part Status
Active
Process
Lead Free
Type
Wire Solder
Form
Spool, 0.07 oz (2g)
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 14
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All prices are in EUR
Bulk
QuantityUnit PriceExt Price
116,99000 €16,99 €
Manufacturers Standard Package
Unit Price without VAT:16,99000 €
Unit Price with VAT:20,38800 €