SMD to DIP PowerSOIC, PSOP, HSOP 24 0.039" (1.00mm) FR4 Epoxy Glass
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
SMD to DIP PowerSOIC, PSOP, HSOP 24 0.039" (1.00mm) FR4 Epoxy Glass

IPC0048

DigiKey Part Number
IPC0048-ND
Manufacturer
Manufacturer Product Number
IPC0048
Description
POWERSOIC-24/PSOP-24/HSOP-24
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
SMD to DIP PowerSOIC, PSOP, HSOP 24 0.039" (1.00mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
Filter Similar Products
Category
Package Accepted
PowerSOIC, PSOP, HSOP
Manufacturer
Chip Quik Inc.
Number of Positions
24
Series
Pitch
0.039" (1.00mm)
Packaging
Bulk
Board Thickness
0.062" (1.57mm) 1/16"
Part Status
Active
Material
FR4 Epoxy Glass
Proto Board Type
SMD to DIP
Size / Dimension
1.000" x 1.400" (25.40mm x 35.56mm)
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 1
Check for Additional Incoming Stock
All prices are in EUR
Bulk
QuantityUnit PriceExt Price
17,64000 €7,64 €
Manufacturers Standard Package
Unit Price without VAT:7,64000 €
Unit Price with VAT:9,16800 €