Name: HF115AC-0.0055-AC-54
Brand: Bergquist
SKU: BER167-ND
Price: 0.972 EUR
Availability: OutOfStock

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HF115AC-0.0055-AC-54
Digi-Key Part Number	BER167-ND
Manufacturer	Bergquist
Manufacturer Product Number	HF115AC-0.0055-AC-54
Description	THERM PAD 19.05MMX12.7MM W/ADH
Manufacturer Standard Lead Time	10 Weeks
Detailed Description	Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Customer Reference
Datasheet	Datasheet

Type	Description	Select
Category	Fans, Thermal Management Thermal Pads, Sheets
Mfr	Bergquist
Series	Hi-Flow® 115-AC
Package	Bulk
Product Status	Active
Usage	TO-220
Type	Pad, Sheet
Shape	Rectangular
Outline	19.05mm x 12.70mm
Thickness	0.0055" (0.140mm)
Material	Phase Change Compound
Adhesive	Adhesive - One Side
Backing, Carrier	Fiberglass
Color	Gray
Thermal Resistivity	0.35°C/W
Thermal Conductivity	0.8W/m-K
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	-
Base Product Number	HF115AC

Resource Type	Link
Datasheets	Hi-Flow 115-AC Datasheet Sil-Pad Metric Configurations Thermal Interface Materials
Other Related Documents	Thermal Ordering Info
PCN Packaging	Henkel/Berquist Revised Brands 10/May/2016
PCN Manufacturer Information	Multiple Devices Manufacture Information 25/Oct/2019
Forum Discussions	Bergquist Thermal Pad, Sheets Outline Configuration Suffix’s

Attribute	Description
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
ECCN	EAR99
HTSUS	3919.90.5060

HF115AC-0.0055-AC-54 is out of stock and can be placed on backorder.

HF115AC-0.0055-AC-54

Attribute	Description
Other Names	BER167 HF115AC00055AC54 HF115TAAC-54 2191181 BG426641 HF115AC-54
Standard Package	100