Image of Teltonika Remote Management System Updated Remote Management System for Effortless Device Management Updated: 2025-12-15

The Teltonika remote management system (RMS) is a cloud-based platform designed to provide centralized and secure management of IoT products.

FPGA order book Updated: 2025-12-15

Learn how to implement a bid/ask order book on an FPGA using SystemVerilog arrays to maintain best-bid and best-ask values.

Image of High-Side Linear LED Driver Family with Thermal Shunt/Sharing
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High-Side Linear LED Driver Family with Thermal Shunt/Sharing Publish Date: 2025-12-15

The Lumissil Microsystems IS32LT315x family of high-side linear LED drivers is designed to meet the harsh demands of automotive lighting applications.

Press-Fit Panel Mount Light Pipe Design Kit
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Press-Fit Panel Mount Light Pipe Design Kit Publish Date: 2025-12-15

The Bivar PPF-DESIGNKIT-001 design kit provides an efficient way to explore and evaluate press-fit panel mount light pipe options for precise LED indication.

Murata Type 2WS STM32 Nucleo to M.2 Adapter Board - Unboxing | DigiKey

We take a look at the Type 2WS STM32 Nucleo to M.2 Adapter Board from Murata.

Image of Flex Power Modules BMR352 Intermediate Bus Converter
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BMR352 Intermediate Bus Converter Publish Date: 2025-12-15

Flex Power Modules BMR352 non-isolated, regulated, digital intermediate bus converter (IBC) features a PMBus interface and up to 97.9% efficiency at half load.

Image of CLIFF Electronics Switching 4 mm Banana Socket
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Switching 4 mm Banana Socket Publish Date: 2025-12-15

CLIFF Electronics introduces their switching 4 mm banana sockets, engineered for high-voltage use and laboratory-grade robustness.

Image of Liquiphant FTL43 Series Hygienic Point Level Switches Liquiphant® FTL43 Series Hygienic Point Level Switches Publish Date: 2025-12-15

Endress+Hauser Liquiphant® FTL43 series are compact vibronic point level switches designed for hygienic applications.

XENSIV™ TLE4971 TISON-8-5 Package Product Brief

Product brief for Infineon's TLE4971 magnetic current sensor in a TISON-8-5 package.

Image of RiseLink Logo RiseLink

RiseLink brings proven wireless and AI chips to innovators. RiseLink ships 300 million chips annually that power devices for Samsung, LG, Amazon, and hundreds of connected device makers worldwide.

XENSIV™ TLE4971 TISON-8-6 Package Product Brief

Product brief for Infineon's TLE4971 magnetic current sensor in a TISON-8-5 package.

Image of ULTRAVOLT / Advanced Energy 30EFL12 Series Floating Hot Deck Low-Voltage Power Supplies 30EFL12 Series Floating Hot Deck Low-Voltage Power Supplies Publish Date: 2025-12-15

ULTRAVOLT / Advanced Energy 30EFL12 series power supplies deliver isolated multi-output, low-voltage power with 30 kV isolation for floating hot deck applications.

Image of Kycon KDMI42X Series Connectors with Enhanced Shielding
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KDMI42X Series Connectors with Enhanced Shielding Publish Date: 2025-12-15

Kycon KDMI42X connectors offer better panel grounding and port-to-port shielding, providing improved performance and reliability for a range of applications.

Image of ULTRAVOLT / Advanced Energy 30LE24 Series Ultra-High-Voltage 30 kV DC/DC Converters 30LE24 Series Ultra-High-Voltage 30 kV DC/DC Converters Publish Date: 2025-12-15

ULTRAVOLT / Advanced Energy 30LE24 series DC/DC converters deliver up to 30 kVDC with low ripple and precise analog control for critical high-voltage applications.

How to make simple Variable HIGH VOLTAGE Power Supply Updated: 2025-12-15

Build a simple yet effective variable high voltage power supply using affordable components, offering precise control for high-voltage experiments.

Silicon Power MOSFETs - Infineon’s Path to Global Market Leadership

Learn why Infineon is the global leader in silicon power MOSFETs and how our expertise, broad portfolio, and unmatched technology are shaping the future of power electronics.

Image of Switchcraft IP68 Sealed Unmated DC Power Jacks
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IP68 Sealed Unmated DC Power Jacks Publish Date: 2025-12-12

The sealed unmated DC power jacks from Switchcraft represent a significant advance in power connectivity for devices deployed in demanding environments.

Image of Bourns SRF3225TAP Series Automotive-Grade Common Mode Chip Inductors SRF3225TAP Series Automotive-Grade Common Mode Chip Inductors Publish Date: 2025-12-12

Bourns SRF3225TAP series automotive-grade common mode chip inductors offer a compact size and shielded construction for low radiation.

Image of NOFFZ Technologies IoT Test Node ITN 1200 IoT Test Node ITN 1200 Publish Date: 2025-12-12

The ITN 1200 from NOFFZ is a test tool designed for developers, QA teams, and integrators working on smart home and industrial IoT (IIoT) devices.

Image of FDK DK HY0022 Evaluation Board for HY0020 BLE Module HY0022 Evaluation Board for HY0020 BLE Module Publish Date: 2025-12-12

The HY0022 evaluation board from FDK America, Inc. enables rapid prototyping and validates wireless connectivity.