Henkel/LOCTITE

- La marque LOCTITE est reconnue dans le monde entier pour sa fiabilité, ses performances et sa rentabilité exceptionnelles. Ces attributs sont présents dans toute la gamme de produits LOCTITE et ont permis d'établir la marque en tant que leader pour un éventail d'applications électroniques.

Avec des produits pour les matériaux d'interface thermique, les enrobages conformes, les produits d'étanchéité et les adhésifs à montage en surface, le nom de LOCTITE est synonyme d'innovation et de performances supérieures. De plus, tous les matériaux LOCTITE sont soutenus par les années d'expertise en matière de formulation, par l'infrastructure de support global inégalée et par les résultats sur site incontestables de Henkel.

Thermally Conductive Epoxy

Image of LOCTITE/STYCAST's Thermally Conductive Epoxy

LOCTITE STYCAST 2850FT is a two-part, thermally conductive epoxy potting material that provides electrical insulation, thermal-shock resistance, low CTE and is available with multiple catalysts. Learn More

LOCTITE / Multicore Solder Wires

Image of LOCTITE/Multicore's Solder Wire

The LOCTITE / Multicore cored solder wire portfolio features multiple flux core technology that ensures even and consistent distribution of flux throughout the solder wire, and is available in multiple alloys and diameters. Learn More

Thermal Gap Pads

Image of Henkel/Bergquist's Thermal Gap Pads

Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability. Learn More

Newest Products Tout afficher (59)

Loctite GC10 Compatibility with Underfill UF3810 and Encapsulant EN 3838T Date de publication : 0001-01-01

Evaluate compatibility of Loctite GC10 with Henkel underfill UF3810 and Henkel Encapsulant 3838T

Epoxy Flux Technology Date de publication : 0001-01-01

Epoxy flux technology tacky flux with value added benefits from Multicore.

Bergquist / Henkel Date de publication : 0001-01-01

The Bergquist Company is the world’s leading developer and manufacturer of thermal management materials which include Sil-Pad®, thermally conductive insulators and various specialty materials; Gap Pad®, gap filling materials, Hi-Flow®, phase change materials, Softface® and Bond-Ply®.

Repair Instructions - Hi-Flow 225FT Date de publication : 0001-01-01

Bergquist's Hi-Flow 225FT is a “tackified” phase change material on an aluminum carrier designed for ease of use with “reworkable” characteristics.

Loctite Handling Guidelines Temperature Stable Solder Paste Date de publication : 0001-01-01

Handling Guidelines Temperature Stable Solder Paste

Solder Wire Solutions Date de publication : 0001-01-01

The Multicore portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire.

Recent PTMs Tout afficher (59)

Loctite GC10 Compatibility with Underfill UF3810 and Encapsulant EN 3838T Date de publication : 0001-01-01

Evaluate compatibility of Loctite GC10 with Henkel underfill UF3810 and Henkel Encapsulant 3838T

Epoxy Flux Technology Date de publication : 0001-01-01

Epoxy flux technology tacky flux with value added benefits from Multicore.

Bergquist / Henkel Date de publication : 0001-01-01

The Bergquist Company is the world’s leading developer and manufacturer of thermal management materials which include Sil-Pad®, thermally conductive insulators and various specialty materials; Gap Pad®, gap filling materials, Hi-Flow®, phase change materials, Softface® and Bond-Ply®.

Repair Instructions - Hi-Flow 225FT Date de publication : 0001-01-01

Bergquist's Hi-Flow 225FT is a “tackified” phase change material on an aluminum carrier designed for ease of use with “reworkable” characteristics.

Featured Videos Tout afficher (59)