Bergquist

- Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).

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Thermally Conductive Epoxy

Image of LOCTITE/STYCAST's Thermally Conductive Epoxy

LOCTITE STYCAST 2850FT is a two-part, thermally conductive epoxy potting material that provides electrical insulation, thermal-shock resistance, low CTE and is available with multiple catalysts. Learn More

LOCTITE / Multicore Solder Wires

Image of LOCTITE/Multicore's Solder Wire

The LOCTITE / Multicore cored solder wire portfolio features multiple flux core technology that ensures even and consistent distribution of flux throughout the solder wire, and is available in multiple alloys and diameters. Learn More

Thermal Gap Pads

Image of Henkel/Bergquist's Thermal Gap Pads

Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability. Learn More

Newest Products Tout afficher (6)

Gap Pad HC 5.0

Matériau de remplissage souple et conforme, le Gap Pad HC 5.0 de Bergquist présente une conductivité thermique de 5,0 W/m-K et fournit des performances thermiques exceptionnelles, avec de très faibles contraintes de compression. En savoir plus

Sil-Pad® 900S

Le matériau isolant Sil-Pad® 900S présente une impédance thermique de 0,61°C-po2/W (à 50 psi) pour les applications telles que les alimentations. En savoir plus

Q-Pad® 3

L'interface thermique de remplacement des graisses renforcée de verre Q-Pad® 3 peut être installée avant le soudage et le nettoyage. En savoir plus

Gap Pad® 1500

Le matériau de remplissage non renforcé Gap Pad® 1500 présente une conductivité thermique de 1,5 W/m K et une faible dureté conformable. En savoir plus

Sil-Pad® K-10

L'isolateur basé Kapton Sil-Pad® K-10 offre de bonnes propriétés de recoupe et d'excellentes performances thermiques. En savoir plus

Gap Pad® VO Ultra Soft

Le Gap Pad® VO Ultra Soft pour le remplissage d'entrefers présente une conductivité thermique de 1,0 W/m-K et il est destiné aux applications à faibles contraintes. En savoir plus

Recent PTMs Tout afficher (5)

Gap Pad EMI 1 Date de publication : 2015-11-16

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Duration: 15 minutes
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft Date de publication : 2014-02-18

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Duration: 5 minutes
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics Date de publication : 2013-11-04

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Duration: 15 minutes
Thermal Interface Materials (TIM) Gap Pad Date de publication : 2013-07-24

An electrically isolating material which provides protection between heat sinks and high voltage devices.

Duration: 5 minutes

Featured Videos Tout afficher (1)

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.

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