TDA8777 Datasheet by NXP USA Inc.

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PHILIPS
1. General description
The TDA8777 consists of three separate 10-bit video Digital-to-Analog Converters (DACs)
with complementary outputs. They convert the digital input signals into analog current
outputs at a maximum conversion rate of 330 MHz.
The DACs are based on current source architecture.
A sync pulse can be added to the green signal (sync-on-green) to allow devices driven by
the video DAC to be synchronized.
The TDA8777 has a Power-down mode to reduce power consumption during inactive
periods.
The TDA8777 is fabricated in a CMOS process that ensures high functionality with low
power dissipation.
2. Features
nTriple 10-bit DAC
nSampling frequency up to 330 MHz
nInternal voltage reference (1.21 V)
nComplementary outputs
nDirect drive of double terminated 75 load into standard level
nTTL compatible input
nSync and blank control inputs
nAnalog output current source
nPower-down mode
n3.3 V power supply
nLQFP48 package
3. Applications
nPC video cards
nHigh resolution image processing
nDigital video systems
nGeneral purpose high-speed digital-to-analog conversion
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
Rev. 04 — 11 April 2006 Product data sheet
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 2 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
4. Quick reference data
5. Ordering information
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDDA analog supply voltage 3.0 3.3 3.6 V
IDDA analog supply current - 90 - mA
INL integral non-linearity 2 - +2 LSB
DNL differential non-linearity 1 - +1 LSB
fCLK clock frequency
TDA8777HL/14/C1 - - 140 MHz
TDA8777HL/24/C1 - - 240 MHz
TDA8777HL/33/C1 - - 330 MHz
Ptot total power dissipation - 297 - mW
Ipd current in Power-down mode - 20 - mA
Table 2. Ordering information
Type number Package Sampling
frequency
Name Description Version
TDA8777HL/14/C1 LQFP48 plastic low profile quad flat package;
48 leads; body 7 × 7 × 1.4 mm SOT313-2 140 MHz
TDA8777HL/24/C1 240 MHz
TDA8777HL/33/C1 330 MHz
48739 1071 23714
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 3 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
6. Block diagram
Fig 1. Block diagram
mle290
10
10
10
23-14
11
24 12
36
34
33
10
10
10
CURRENT/VOLTAGE REFERENCE
DAC CONTROL MODULE
3537
COMP
Vref + Iref Iref
Vref + Iref
Vref + Iref
RSET
SYNC
INSERT
sync
SYNC
10-BIT DAC
BLANKING
INSERT
10
10
10
TRIPLE
MULTI-
PLEXER
38
VSSA1
25
VSSA2
VDDA1
26
PSAVE
VREF
blue digital
inputs
(bits B9 to B0)
10-1
green digital
inputs
(bits G9 to G0)
48-39
13
VDDA2 29
red digital
inputs
(bits R9 to R0)
TDA8777
OUTG
OUTG
OUTB
OUTB
BLANKCLK
32
31
28
27
10-BIT DAC
10-BIT DAC
POR
OUTR
OUTR
VDDA3 30
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 4 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
7. Pinning information
7.1 Pinning
7.2 Pin description
Fig 2. Pin configuration
TDA8777HL
G0 VREF
G1 COMP
G2 OUTR
G3 OUTR
G4 OUTG
G5 OUTG
G6 VDDA3
G7 VDDA2
G8 OUTB
G9 OUTB
BLANK VSSA2
SYNC VSSA1
VDDA1 R9
B0 R8
B1 R7
B2 R6
B3 R5
B4 R4
B5 R3
B6 R2
B7 R1
B8 R0
B9
CLK
PSAVE
RSET
001aad432
1
2
3
4
5
6
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
13
14
15
16
17
18
19
20
21
22
23
48
47
46
45
44
43
42
41
40
39
38
37
24
Table 3. Pin description
Symbol Pin Description
G0 1 green digital input data; bit 0 (LSB)
G1 2 green digital input data; bit 1
G2 3 green digital input data; bit 2
G3 4 green digital input data; bit 3
G4 5 green digital input data; bit 4
G5 6 green digital input data; bit 5
G6 7 green digital input data; bit 6
G7 8 green digital input data; bit 7
G8 9 green digital input data; bit 8
G9 10 green digital input data; bit 9 (MSB)
BLANK 11 composite blank control input (active LOW)
SYNC 12 composite sync control input; for green channel only (active LOW)
VDDA1 13 analog supply voltage 1
B0 14 blue digital input data; bit 0 (LSB)
B1 15 blue digital input data; bit 1
B2 16 blue digital input data; bit 2
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 5 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
8. Functional description
This triple 10-bit video DAC is designed to convert digital input signals into analog output
currents. All inputs (clock, data, blank and sync) must be TLL levels.
8.1 Voltage reference
The voltage reference input to pin VREF should be 1.21 V. For correct operation, a 100 nF
capacitor should be connected between pin VREF and pin VDDA.
B3 17 blue digital input data; bit 3
B4 18 blue digital input data; bit 4
B5 19 blue digital input data; bit 5
B6 20 blue digital input data; bit 6
B7 21 blue digital input data; bit 7
B8 22 blue digital input data; bit 8
B9 23 blue digital input data; bit 9 (MSB)
CLK 24 clock input
VSSA1 25 analog supply ground 1
VSSA2 26 analog supply ground 2
OUTB 27 complementary blue current analog output
OUTB 28 blue current analog output
VDDA2 29 analog supply voltage 2
VDDA3 30 analog supply voltage 3
OUTG 31 complementary green current analog output
OUTG 32 green current analog output
OUTR 33 complementary red current analog output
OUTR 34 red current analog output
COMP 35 compliance voltage output
VREF 36 voltage reference input
RSET 37 full-scale current control resistor pin
PSAVE 38 power-save control input (active LOW)
R0 39 red digital input data; bit 0 (LSB)
R1 40 red digital input data; bit 1
R2 41 red digital input data; bit 2
R3 42 red digital input data; bit 3
R4 43 red digital input data; bit 4
R5 44 red digital input data; bit 5
R6 45 red digital input data; bit 6
R7 46 red digital input data; bit 7
R8 47 red digital input data; bit 8
R9 48 red digital input data; bit 9 (MSB)
Table 3. Pin description
…continued
Symbol Pin Description
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 6 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
An external reference resistor must be connected between pin RSET and analog ground.
This resistor sets the reference current which determines the analog output level, and is
specified to be 560 . This value allows a 1 V (p-p) output (video plus sync) into a 37.5
load, such as a double-terminated 75 coaxial cable.
8.2 Blanking and sync pulse insertion
The video signal (see Figure 3) is comprised of the following three parts:
The video information: defined by the 10 bits used to drive the DAC; nominal signal
amplitude = 700 mV (p-p)
The sync pulse: a horizontal synchronization (hsync) pulse indicates the end of a
video line and the start of the next video line; sync nominal amplitude = 300 mV; sync
is added to the video signal output via the SYNC input (active LOW)
The blanking period: allows interface-free detection of both sync and video, blanking
is allocated either side of the sync pulse; the blank level is equal to the video black
level; blanking is added to the video signal output via the BLANK input (active LOW).
The values of SYNC and BLANK are latched on the rising edge of the clock signal. When
no sync and no blank are applied, the DAC can be used continuously. This is the so-called
generic mode.
Because the signal delay in the DAC is 1.5 times the clock period, the sync and blank are
also delayed by 1.5 times the clock period.
9. Limiting values
Fig 3. Video signal sync pulse and blanking period
mle291
sync pulse
blanking period video information
0.7 V
0.3 V
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDDA analog supply voltage referred to VSSA1 0.5 +6.5 V
Vnvoltage on digital input pins referred to VSSA2 0.5 +5.5 V
Tstg storage temperature 55 +150 °C
Tamb ambient temperature 0 70 °C
Tjjunction temperature 40 +125 °C
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 7 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
10. Thermal characteristics
11. Characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction to ambient in free air for SOT313-2 88 K/W
Table 6. Characteristics
Typical values measured at V
DDA
= 3.3 V; R
RSET
= 560
; T
amb
=25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supplies
VDDA analog supply voltage 3.0 3.3 3.6 V
IDDA analog supply current - 90 - mA
Ptot total power dissipation - 297 - mW
Ipd current in Power-down mode - 20 - mA
Inputs
VIL LOW-level input voltage - - 0.8 V
VIH HIGH-level input voltage 2.0 - - V
IIL LOW-level input current - - 80 µA
IIH HIGH-level input current - - 120 µA
CIN input capacitance - 5 - pF
Band gap reference
VDDA analog supply voltage 3.0 3.3 3.6 V
IDDA analog supply current - 2.7 - mA
VVREF reference voltage input - 1.23 - V
RRSET resistor for reference current - 560 -
Digital-to-analog converter
RESDAC DAC resolution - - 10 bits
Io(DAC) DAC to DAC output current
matching --4%
INL integral non-linearity 1.8 - +1.8 LSB
DNL differential non-linearity 0.9 - +0.9 LSB
DACCT DAC to DAC crosstalk - 54 - dB
THD total harmonic distortion fCLK = 140 MHz
fOUT = 1 MHz - 60 - dB
fOUT = 2.2 MHz - 60 - dB
fOUT = 4.7 MHz - 60 - dB
fOUT = 12 MHz - 59 - dB
fOUT = 22 MHz - 58 - dB
fOUT = 39 MHz - 57 - dB
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 8 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
THD total harmonic distortion fCLK = 240 MHz
fOUT = 1 MHz - 60 - dB
fOUT = 2.2 MHz - 60 - dB
fOUT = 4.7 MHz - 60 - dB
fOUT = 12 MHz - 60 - dB
fOUT = 22 MHz - 54 - dB
fOUT = 39 MHz - 51 - dB
fCLK = 330 MHz
fOUT = 1 MHz - 60 - dB
fOUT = 2.2 MHz - 60 - dB
fOUT = 4.7 MHz - 60 - dB
fOUT = 12 MHz - 60 - dB
fOUT = 22 MHz - 53 - dB
fOUT = 39 MHz - 47 - dB
SFDR spurious-free dynamic range to
Nyquist limit fCLK = 140 MHz
fOUT = 1 MHz - 62 - dB
fOUT = 2.2 MHz - 62 - dB
fOUT = 4.7 MHz - 63 - dB
fOUT = 12 MHz - 63 - dB
fOUT = 22 MHz - 61 - dB
fOUT = 39 MHz - 61 - dB
fCLK = 240 MHz
fOUT = 1 MHz - 61 - dB
fOUT = 2.2 MHz - 61 - dB
fOUT = 4.7 MHz - 63 - dB
fOUT = 12 MHz - 58 - dB
fOUT = 22 MHz - 58 - dB
fOUT = 39 MHz - 54 - dB
fCLK = 330 MHz
fOUT = 1 MHz - 59 - dB
fOUT = 2.2 MHz - 60 - dB
fOUT = 4.7 MHz - 54 - dB
fOUT = 12 MHz - 56 - dB
fOUT = 22 MHz - 55 - dB
fOUT = 39 MHz - 49 - dB
Outputs
VO(compl) output voltage compliance 0 - 1.4 V
COUT output capacitance - 10 - pF
Table 6. Characteristics
…continued
Typical values measured at V
DDA
= 3.3 V; R
RSET
= 560
; T
amb
=25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 9 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
Timing
fCLK clock frequency
TDA8777HL/14/C1 140 - - MHz
TDA8777HL/24/C1 240 - - MHz
TDA8777HL/33/C1 330 - - MHz
td(p) pipeline delay in clock cycles 2.5 2.5 2.5
tsu(i) input set-up time see Figure 4 0--ns
th(i) input hold time see Figure 4 1.45 - - ns
td(o) output delay time see Figure 4 - 3.75 - ns
Table 6. Characteristics
…continued
Typical values measured at V
DDA
= 3.3 V; R
RSET
= 560
; T
amb
=25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Output delay (td(o)) is measured from the 50 % point of the rising edge of CLK to the 50 % point of full-scale transition.
Fig 4. Timing diagram digital inputs and analog outputs
001aaa892
CLK
Analog outputs
(OUTB, OUTB,
OUTG, OUTG
OUTR, OUTR)
td(o)
Digital inputs
(R9 to R0, G9 to G0,
B9 to B0, SYNC,
BLANK)
th(i)
tsu(i)
DATA
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 10 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
12. Application information
Sampling frequency = 140 MHz. Sampling frequency = 240 MHz.
Fig 5. THD as a function of fOUT, typical values Fig 6. THD as a function of fOUT, typical values
Sampling frequency = 330 MHz. Sampling frequency = 140 MHz.
Fig 7. THD as a function of fOUT, typical values Fig 8. SFDR as a function of fOUT, typical values
001aad345
fOUT (MHz)
110
2
10
40
60
20
0
THD
(dB)
80
001aad347
fOUT (MHz)
110
2
10
40
60
20
0
THD
(dB)
80
001aad348
fOUT (MHz)
110
2
10
40
60
20
0
THD
(dB)
80
001aad427
fOUT (MHz)
110
2
10
40
60
20
0
SFDR
(dB)
80
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 11 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
Sampling frequency = 240 MHz Sampling frequency = 330 MHz.
Fig 9. SFDR as a function of fOUT, typical values. Fig 10. SFDR as a function of fOUT, typical values
Fig 11. Application diagram
001aad428
fOUT (MHz)
110
2
10
40
60
20
0
SFDR
(dB)
80
001aad429
fOUT (MHz)
110
2
10
40
60
20
0
SFDR
(dB)
80
001aaa890
560
0.1 µF
TDA8777
36 VREF
35 COMP
34 OUTR
33 OUTR
32 OUTG
31 OUTG
3738
PSAVE
RSET
39
R0
40
R1
41
R2
42
R3
43
R4
44
R5
45
R6
46
R7
47
R8
48
R9
30 VDDA3
29 VDDA2
28 OUTB
27 OUTB
26 VSSA2
25 VSSA1
VDDA
2423
B9
CLK
22
B8
21
B7
20
B6
19
B5
18
B4
17
B3
16
B2
15
B1
14
B0
13
VDDA1
1
G0
2
G1
3
G2
4
G3
5
G4
6
G5
7
G6
8
G7
9
G8
10
G9
11
BLANK
12
SYNC
VDDA
J"
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 12 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
13. Package outline
Fig 12. Package outline SOT313-2 (LQFP48)
UNIT A
max. A1A2A3bpcE
(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 1.6 0.20
0.05 1.45
1.35 0.25 0.27
0.17 0.18
0.12 7.1
6.9 0.5 9.15
8.85 0.95
0.55 7
0
o
o
0.12 0.10.21
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2 MS-026136E05 00-01-19
03-02-25
D(1) (1)(1)
7.1
6.9
HD
9.15
8.85
E
Z
0.95
0.55
D
bp
e
E
B
12
D
H
bp
E
H
vMB
D
ZD
A
ZE
e
vMA
1
48
37
36 25
24
13
θ
A1
A
Lp
detail X
L
(A )
3
A2
X
y
c
wM
wM
0 2.5 5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 13 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °Cto260°C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225 °C (SnPb process) or below 245 °C (Pb-free process)
for all BGA, HTSSON..T and SSOP..T packages
for packages with a thickness 2.5 mm
for packages with a thickness < 2.5 mm and a volume 350 mm3 so called
thick/large packages.
below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
—[uoT edi ed,
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 14 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
14.5 Package related soldering information
[1] For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026);
order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods
.
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C±10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
Table 7. Suitability of surface mount IC packages for wave and reflow soldering methods
Package[1] Soldering method
Wave Reflow[2]
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,
SSOP..T[3], TFBGA, VFBGA, XSON not suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[4] suitable
PLCC[5], SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended[5][6] suitable
SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable
CWQCCN..L[8], PMFP[9], WQCCN..L[8] not suitable not suitable
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 15 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 16 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
15. Revision history
Table 8. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TDA8777_4 20060411 Product data sheet - TDA8777_3
Modifications: Status changed to Product data sheet.
Characteristics table revised, see Table 6.
TDA8777_3 20050815 Preliminary data sheet - TDA8777_2
Modifications: The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
Status changed to Preliminary data sheet.
Characteristics table revised, SPDR and THD data added, see Table 6.
Figure 4 corrected.
Figure 5 through to Figure 10 added.
TDA8777_2
(9397 750 13219) 20040517 Objective specification - TDA8777_1
TDA8777_1
(9397 750 12054) 20040108 Objective specification - -
TDA8777_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 11 April 2006 17 of 18
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.semiconductors.philips.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.semiconductors.philips.com/profile/terms, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
Philips Semiconductors TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Date of release: 11 April 2006
Document identifier: TDA8777_4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Functional description . . . . . . . . . . . . . . . . . . . 5
8.1 Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5
8.2 Blanking and sync pulse insertion . . . . . . . . . . 6
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Application information. . . . . . . . . . . . . . . . . . 10
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.1 Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
14.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13
14.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14
14.5 Package related soldering information . . . . . . 14
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
17 Contact information. . . . . . . . . . . . . . . . . . . . . 17
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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