Improve accuracy of AOI in PCB production by using modern package technology

Automatic Optical Inspection (AOI) is key to PCB assembly because it verifies the quality of the solder joint, thereby ensuring the robustness of the PCB. If AOI fails to correctly verify the solder it results in a loss of time and money.

Trench Schottky rectifiers for fast switching applications

Nexperia’s Trench Schottky rectifiers offer excellent switching behavior and low conduction losses, leading thermal performance and extended safe operating area. Making them the ideal choice for automotive applications.

Meet automotive Board Level Reliability (BLR) requirements with Nexperia’s CFP15B Package

The CFP15B clip-bond FlatPower package is engineered for maximum robustness and reliability under the toughest conditions, making it ideal for automotive applications.

What is LFPAK56D half-bridge?

Join Ding as he explains all you need to know about Nexperia's LFPAK56D half-bridge package, PCB connection options, package concept, and key features.

PCB layout options for MOSFETs in low/medium power automotive motor control

Join Richard as he talks through three MOSFET packages that best fit into the low/medium power automotive motor control application space, discussing the highs and lows of each.

Introducing Silicon Germanium (SiGe) rectifiers

Silicon Germanium (SiGe) rectifiers deliver cutting-edge high efficiency, thermal stability and space-savings. Nexperia’s SiGe rectifiers combine the high efficiency of Schottky rectifiers with the thermal stability of fast recovery diodes.

Sige Rectifiers in CFP Packages | Datasheet Preview

Nexperia’s silicon-germanium rectifiers provide high efficiency in a small form factor package that provides excellent electrical and thermal performance.

TrEOS ESD Protection for USB Type-C®

Nexperia’s TrEOS technology optimizes the three pillars of ESD protection: Low capacitance for highest signal integrity, Low clamping and trigger for enhanced system protection, and High robustness against ESD and Surge transients.

Automotive ESD protection

High ESD robustness is key to ensuring the reliable, high performance of automotive applications. The trend toward increasing data payload in vehicles due to electrification and connectivity challenges hardware engineers with ESD robustness decrease.

Quick Learning: Increasing thermal capability in Small signal MOSFETs

As designs get smaller there is an increasing demand for MOSFETs to have high power capabilities in smaller packages. Reducing the size of components has a great impact on thermal management, as power dissipation must occur on smaller die sizes.

Introducing Automotive DFN packages

To satisfy an ever-increasing number of electronic functions, vehicles require more semiconductor components. Watch how Nexperia’ s AEC-Q101 qualified leadless packages with side-wettable flanks help save space and minimize weight.

Automotive DFN Packages

Nexperia’s AEC-Q101 qualified leadless packages with side-wettable flanks help save space and minimize weight while ensuring the performance and efficiency of these components – especially at high temperatures.

Increasing thermal capability in Small signal MOSFETs

Here we take a look at the evolution of small-signal MOSFET packages to gain a better understanding of thermal performance, focusing on simulation and measurement results.

The Importance of SOA

Join Stein Nesbakk as he explains for which applications SOA is vital, but also how to achieve the balance between low RDS(on) and strong SOA.

High Current Demo

In this demo, we are using a PSMNR51-25YLH (25V, 0.57Rdson, 380A) MOSFET in a LFPAK56 package. The 7.5 minute demo is quite remarkable, showcasing the value add of the LFPAK package.

Nexperia GaN FETs

As a global expert for high performance Power FETs, Nexperia now introduces high-voltage devices with GaN-on-Silicon FET technology.

Quick Learning: How to read a GaN FET datasheet

In this quick learning session we review a typical Nexperia GaN FET datasheet, and explore the key values and tolerances for consideration.

Quick Learning: Moving from silicon to GaN: Design considerations

Gallium Nitride on silicon technology brings a significant performance advantage over traditional Silicon alternatives.

Thermal Concerns of the LFPAK88 and D2Pack

Senior MOSFET Applications Engineer, Sami Ould-Ahmed, will address thermal concerns in two popular packages from Nexperia. One being the LFPAK88 and the other being the D2PAK.

Quick Learning: RC thermal simulation of power MOSFETs

RC thermal simulation of MOSFETs is an important tool for early design validation, allowing engineers to quickly check the device is suitable for the power and temperatures associated with the application.