Automatic Optical Inspection (AOI) is key to PCB assembly because it verifies the quality of the solder joint, thereby ensuring the robustness of the PCB. If AOI fails to correctly verify the solder it results in a loss of time and money.
Nexperia’s Trench Schottky rectifiers offer excellent switching behavior and low conduction losses, leading thermal performance and extended safe operating area. Making them the ideal choice for automotive applications.
The CFP15B clip-bond FlatPower package is engineered for maximum robustness and reliability under the toughest conditions, making it ideal for automotive applications.
Join Richard as he talks through three MOSFET packages that best fit into the low/medium power automotive motor control application space, discussing the highs and lows of each.
Silicon Germanium (SiGe) rectifiers deliver cutting-edge high efficiency, thermal stability and space-savings. Nexperia’s SiGe rectifiers combine the high efficiency of Schottky rectifiers with the thermal stability of fast recovery diodes.
Nexperia’s silicon-germanium rectifiers provide high efficiency in a small form factor package that provides excellent electrical and thermal performance.
Nexperia’s TrEOS technology optimizes the three pillars of ESD protection: Low capacitance for highest signal integrity, Low clamping and trigger for enhanced system protection, and High robustness against ESD and Surge transients.
High ESD robustness is key to ensuring the reliable, high performance of automotive applications. The trend toward increasing data payload in vehicles due to electrification and connectivity challenges hardware engineers with ESD robustness decrease.
As designs get smaller there is an increasing demand for MOSFETs to have high power capabilities in smaller packages. Reducing the size of components has a great impact on thermal management, as power dissipation must occur on smaller die sizes.
To satisfy an ever-increasing number of electronic functions, vehicles require more semiconductor components. Watch how Nexperia’ s AEC-Q101 qualified leadless packages with side-wettable flanks help save space and minimize weight.
Nexperia’s AEC-Q101 qualified leadless packages with side-wettable flanks help save space and minimize weight while ensuring the performance and efficiency of these components – especially at high temperatures.
Here we take a look at the evolution of small-signal MOSFET packages to gain a better understanding of thermal performance, focusing on simulation and measurement results.
In this demo, we are using a PSMNR51-25YLH (25V, 0.57Rdson, 380A) MOSFET in a LFPAK56 package. The 7.5 minute demo is quite remarkable, showcasing the value add of the LFPAK package.
Senior MOSFET Applications Engineer, Sami Ould-Ahmed, will address thermal concerns in two popular packages from Nexperia. One being the LFPAK88 and the other being the D2PAK.
RC thermal simulation of MOSFETs is an important tool for early design validation, allowing engineers to quickly check the device is suitable for the power and temperatures associated with the application.