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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
14-350000-11-RC
14-350000-11-RC
SOCKET ADAPTER SOIC TO 14DIP 0.3
Aries Electronics
1 409
In Stock
1 : 20,00000 €
Tube
Tube
ActiveSMD to DIPSOIC140.050" (1.27mm)0.062" (1.57mm) 1/16"FR4 Epoxy Glass0.700" L x 0.450" W (17.78mm x 11.43mm)
PA0003
PA0003
SOIC-14 TO DIP-14 SMT ADAPTER
Chip Quik Inc.
276
In Stock
1 : 3,30000 €
Bulk
Bulk
ActiveSMD to DIPSOIC140.050" (1.27mm)0.062" (1.57mm) 1/16"FR4 Epoxy Glass0.700" x 0.700" (17.78mm x 17.78mm)
1210
1210
SMT ADAPTERS 6 PACK 14SOIC/TSSOP
Adafruit Industries LLC
118
In Stock
1 : 4,69000 €
Bulk
-
Bulk
ActiveSMD to DIPSOIC, TSSOP14---0.700" L x 0.700" W (17.78mm x 17.78mm)
PA0003C
PA0003C
SOIC-14 TO DIP-14 SMT ADAPTER (1
Chip Quik Inc.
249
In Stock
1 : 6,14000 €
Bulk
Bulk
ActiveSMD to DIPSOIC140.050" (1.27mm)0.063" (1.60mm)FR4 Epoxy Glass0.700" L x 0.400" W (17.78mm x 10.16mm)
LCQT-SOIC14W
LCQT-SOIC14W
SOCKET ADAPTER SOIC-W TO 14DIP
Aries Electronics
80
In Stock
1 : 4,28000 €
Bulk
Bulk
ActiveSMD to DIPSOIC140.050" (1.27mm)0.062" (1.57mm) 1/16"FR4 Epoxy Glass0.700" L x 0.700" W (17.78mm x 17.78mm)
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Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.